| 摘要 |
PROBLEM TO BE SOLVED: To protect the exposed part of a composite wiring board against damage by bonding a first wiring board to a second wiring board through die lubricant and removing a part of the first wiring board through trenching from the rear side thereof. SOLUTION: First grooves 5a, 5b, 25a, 25b of specified shape are made previously in a glass epoxy wiring board 1, 21 which is then bonded with a flexible wiring board, i.e., a polyimide board. Second grooves 39a, 39b, 40a, 40b are then made along the first grooves 5a, 5b, 25a, 25b and the part of glass epoxy boards 1, 21 defined by the first grooves 5a, 5b or 25a, 25b is removed along with die lubricants 31, 32. Consequently, a flex rigid wiring board where the polyimide board is exposed partially can be produced. Since the wiring boards 1, 21 are bonded to the polyimide wiring board without making any window therein, no adhesive flows into a window and the boundary between the wiring boards 1, 21 and the polyimide wiring board can be defined. |
