| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacture of a printed wiring board which does not cause generation of cracks in an outer layer portion stacked on a board even when the outer shape of the printed wiring board is processed with a metal mold. SOLUTION: On both front and back surfaces of an inner-layer board 2 constituting a multilayer printed wiring board 1, an inner-layer conductor pattern 3 and an interlayer insulating layer 4 entirely covering the innerlayer conductor pattern 3 are formed. On the interlayer insulating layer 4, a permanent resist 5 and an outer-layer conductor pattern 6 are formed. Using a pair of carbon dioxide gas laser oscillators 14 facing both front and back surfaces of the multilayer printed wiring board 1, a laser is projected along a predetermined outer shape of the printed wiring board 1. By irradiation the board with the laser, the permanent resist 5, a second resin 10 and an adhesive layer 11 are removed, thereby forming a groove M. Then, the inner-layer board 2 in the groove M of the printed wiring board 1 is punched out by a metal mold. |
