| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize an inner layer signal line suitable for transmission of high frequency signals, regarding a multilayer printed board. SOLUTION: A multilayerd printed board 30 consists of the following; an inner layer signal line 33 formed on an inner layer, flat ground layers 31, 34 which are arranged in the thickness direction of the multilayer printed board 30, interposing the inner layer signal line 33, slit-shaped through holes 40, 41 which are positioned on both sides of the inner layer signal line 33 in the surface direction of the multilayer printed board 30, formed in the inside of the multilayer printed board, and stretched along the inner layer signal line 33, and plating films 52, 53 on inner wall surfaces of the slit-shaped through holes 40, 41. The ground layers 31, 34 and the plating films 52, 53 in the slit-shaped through holes 40, 41 are constituted so as to enclose the inner layer signal line 33 and shield it.</p> |
