| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a work taking a level difference on an upper surface of a substrate into consideration. SOLUTION: A level difference h on an upper surface of a substrate 11 resulting from surface waviness is measured with use of a measurement means. When the level difference h is larger than a height H of bumps 28, all the bumps 28 can be made to have an identical level of height by pushing a flattening tool against the bumps 28. Next adhesive or bond 29 is coated on the substrate 11, a chip 21 is attracted to a die collect 22 by vacuum, and bumps 30 of the chip 21 are placed and mounted on the bumps 28 of the substrate 11. When the level difference h is smaller than the height h of the bumps 28, the bumps cannot be made to have an identical level of height even by flattening all the bumps 28. In this case, the mounting of the chip 21 is stopped and the substrate 11 is discharged out from the production line as a faulty part.</p> |
