METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT TO AN ULTRAFLEXIBLE SUBSTRATE

摘要

A method of electrically connecting an integrated circuit (IC) to at least one electrical conductor on a flexible substrate. A flexible dielectric substrate has an IC attachment area and at least one resonant circuit formed thereon. The resonant circuit is formed with a first conductive pattern disposed on a first principal surface of the flexible substrate and a second conductive pattern disposed on a second, opposite principle surface of the flexible substrate. The first conductive pattern is electrically connected to the second conductive pattern such that the first and second conductive patterns form an inductor and a capacitor, with the inductor also functioning as an antenna. The IC attachment area of the flexible substrate is cleaned and the flexible substrate is secured in a fixed position in a plenum to prevent substantial movement thereof. The IC is secured to the IC attachment area of the flexible substrate to minimize movement of the IC relative to the flexible substrate. Wire bonding of the IC to at least one electrical conductor of the resonant circuit is performed to electrically connect the IC to the at least one electrical conductor. A protective covering is applied over the IC and the wire bond to protect the wire bond from being damaged by external forces.