发明名称 Heated nozzle manifolds in a common plane interconnected through connector manifolds
摘要 Injection molding apparatus with a central heated manifold, a pair of connector manifolds, and at least four nozzle manifolds mounted to extend in a common plane in a mold. A number of heated nozzles extend from each nozzle manifold. A melt passage branches in each nozzle manifold and the nozzle manifolds are made so thermal expansion slides the branches of the melt passage into exact alignment with central melt bores through the nozzles. The central manifold and the two connector manifolds extend along a central axis and each connector manifold is between each pair of nozzle manifolds which are offset from the central axis. Connector bushings slidably connect each connector manifold rearwardly to the central manifold and sidewardly to each nozzle manifold. The connector bushings slide sufficiently to provide sufficient compensation for thermal expansion and contraction to allow either the connector manifolds or the nozzle manifolds to be centrally located relative to the cooled mold, which reduces the distances the melt passage branches must slide to be in proper alignment.
申请公布号 US5707664(A) 申请公布日期 1998.01.13
申请号 US19960692707 申请日期 1996.08.06
申请人 MOLD-MASTERS LIMITED 发明人 MAK, CHUN KEUNG
分类号 B29C45/26;B29C45/27;B29C45/73;(IPC1-7):B29C45/22 主分类号 B29C45/26
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