| 摘要 |
<p>A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a cloth cartridge which is detachably exchangeably mounted on a turntable. The polishing apparatus comprises a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding the workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge includes a cartridge base member and a polishing cloth bonded to an upper surface of the cartridge base member. The cartridge base member comprises a plurality of base member segments, and the polishing cloth comprises a plurality of polishing cloth segments bonded to upper surfaces of the base member segments, respectively. <IMAGE></p> |
