| 摘要 |
PROBLEM TO BE SOLVED: To hold a high bond, strength of an Au alloy wire and stably reduce the tail length caused by the simple tension even after exposure thereof at high temps. for a long time lapsed from forming of bumps on Al-based electrode pads by adding specified amt. of Pd and Bi to a high purity Au. SOLUTION: Pd and Bi are added 0.2-5.0wt.% and 1-100wt.ppm to a high purity Au of the alloy wire, or at least one of Y, La, Ca and Be is added 3-250 wt.ppm. A ball 4 is formed on the top end of an Au wire 2 passed through a capillary 1, the capillary is lowered to depress and bond the ball 4 to an electrode 5 of an IC chip 6, and the wire 2 is pulled up to separate the wire from the depressed ball 4', thereby forming an Au bump 4' for wireless bonding of the electrode 5 of the chip 6 to an outer lead. The Au alloy wire 2 is used in such case. |
