EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING,申请号JP19960139104-传众专利搜索

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发明名称	EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要
申请公布号	JPH09316304(A)	申请公布日期	1997.12.09
申请号	JP19960139104	申请日期	1996.05.31
申请人	SUMITOMO BAKELITE CO LTD	发明人	OTA MASARU
分类号	C08K9/06;C08G59/62;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00	主分类号	C08K9/06
代理机构		代理人
主权项
地址

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