发明名称 |
Method of encapsulating a sensor into a panel body |
摘要 |
<p>A flexible sensor, such as a membrane switch (14), is molded into a plastics automotive panel by a low temperature, low pressure, method which avoids damage to the switch while insuring its placement at a desired depth below the surface of the panel. This is achieved by a process which includes a first step of spraying a mold (10) with a rapid gelling liquid plastics (12) to a preselected thickness. After the plastics has firmed, the sensor (14) is placed thereon and is encapsulated by spraying with a second layer (18) of the plastics. The resulting shell with the embedded sensor may then be provided with a backing, such as a plastics foam. <IMAGE></p> |
申请公布号 |
EP0802030(A2) |
申请公布日期 |
1997.10.22 |
申请号 |
EP19970302179 |
申请日期 |
1997.03.27 |
申请人 |
MORTON INTERNATIONAL, INC. |
发明人 |
HARRIS, BRADLEY D.;LANG, GREGORY J.;WIRT, W. GARY |
分类号 |
B05D1/38;B05D3/00;B05D7/24;B29C41/08;B29C41/20;B29C41/22;B32B27/40;B60Q5/00;B60R21/2165;H01H11/00;H01H13/52;(IPC1-7):B29C41/08;B60R16/00;B60R21/20 |
主分类号 |
B05D1/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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