发明名称 Method of encapsulating a sensor into a panel body
摘要 <p>A flexible sensor, such as a membrane switch (14), is molded into a plastics automotive panel by a low temperature, low pressure, method which avoids damage to the switch while insuring its placement at a desired depth below the surface of the panel. This is achieved by a process which includes a first step of spraying a mold (10) with a rapid gelling liquid plastics (12) to a preselected thickness. After the plastics has firmed, the sensor (14) is placed thereon and is encapsulated by spraying with a second layer (18) of the plastics. The resulting shell with the embedded sensor may then be provided with a backing, such as a plastics foam. <IMAGE></p>
申请公布号 EP0802030(A2) 申请公布日期 1997.10.22
申请号 EP19970302179 申请日期 1997.03.27
申请人 MORTON INTERNATIONAL, INC. 发明人 HARRIS, BRADLEY D.;LANG, GREGORY J.;WIRT, W. GARY
分类号 B05D1/38;B05D3/00;B05D7/24;B29C41/08;B29C41/20;B29C41/22;B32B27/40;B60Q5/00;B60R21/2165;H01H11/00;H01H13/52;(IPC1-7):B29C41/08;B60R16/00;B60R21/20 主分类号 B05D1/38
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