发明名称 |
STRUCTURE FOR COOLING AN INTEGRATED CIRCUIT |
摘要 |
<p>In a structure for cooling an integrated circuit (IC), a hollow cylindrical member is mounted on a cold plate and receives a heat conductor therein. The heat conductor is a cylindrical member which is closed by a flat plate at one end thereof. Silicone gel fills a gap between the hollow cylindrical member and the heat conductor and allows the heat conductor to move due to the elasticity thereof. When the cold plate is fixed in place on the IC which is mounted on a printed circuit board, the heat conductor moves in matching relation to the height and inclination of the IC. As a result, the heat conductor and IC are brought into close contact with each other. A compound intervenes between the heat conductor and the IC to enhance the close contact of the heat conductor and IC.</p> |
申请公布号 |
CA2102662(C) |
申请公布日期 |
1997.10.07 |
申请号 |
CA19932102662 |
申请日期 |
1993.11.08 |
申请人 |
NEC CORPORATION |
发明人 |
AKAMATSU, SHINYA;MINE, SHINJI;SEGUCHI, HIDEKI |
分类号 |
H01L23/433;H01L23/473;(IPC1-7):H01L23/473 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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