| 摘要 |
PURPOSE:To enable cooling capacity to be changed in integrated circuit units according to the degree of power of integrated circuit and to relax restriction to mounting to the integrated circuit by allowing a plurality of integrated circuits to be mounted to a printed-circuit board and specific printed-circuit frame, a cooling board, a refrigerant container, and a nozzle to be owned. CONSTITUTION:It has a plurality of integrated circuits 2 mounted to a printed-circuit board 1, a printed-circuit board frame 3 retaining the printed-circuit board 1, and an outer surface opposing the heat radiation surface of a plurality of integrated circuits 2 sealed to the printed. circuit frame 3 while keeping a small amount of distance from it. Also, it has a cooling plate 5 with a plurality of spot facing holes 4 where a plurality of column-shaped protruding objects 15 are provided at each bottom part, opposing the integrated circuit 2 and with a refrigerant flow path connecting the hole 4, a take-in port 8 of refrigerant, a take-out port 9, and and a suction room 12 which is provided closer to the cooling plate 5 and is connected to a take-in port 8, becoming a tank room of a refrigerant carrier, and an exhaust room is connected to the above take-out port 9 and the refrigerant flow path. Also, it has a refrigerant container 11 with a screw hole at a position corresponding to the spot facing hole 4 of a cooling plate 5 at the bottom part, and a nozzle 7 with a screw engaged to the screw hole of the refrigerant container 11 at one end. |
