发明名称 Sputter target production method
摘要 The method produces a target with a back plate (3) and cooling elements (4) for a sputter cathode of a vacuum coating installation. The method includes several steps: (a) the back plate is provided with parallel grooves (6) and (7, 8); (b) a tightly fitting U-profile (4) is inserted into the groove (6); and (c) the resultant channel (14) is filled with an inert gas, and the legs (10, 11) of the U-profile are joined by TIG welding to the protruding pieces (5, 5') formed by the grooves (7, 8). Next (d) a frame is attached to the back plate on the side opposite to the side with U-profiles to form a tray with raised edges; and (e) this tray is filled with a cast sputter material (9), preferably tin. Also claimed is an alternative method for target production.
申请公布号 DE19611433(A1) 申请公布日期 1997.09.25
申请号 DE19961011433 申请日期 1996.03.22
申请人 LEYBOLD MATERIALS GMBH, 63450 HANAU, DE 发明人 WOLLENBERG, NORBERT, 63538 GROSKROTZENBURG, DE
分类号 C23C14/34;(IPC1-7):C23C14/34;H01J37/34 主分类号 C23C14/34
代理机构 代理人
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