| 摘要 |
PURPOSE:To improve the connection between a lead and a conductor circuit in bonding strength and electrical reliability by a method wherein a plating layer is continuously formed in one piece on the surfaces of a lead, an electrically conductive bonding agent, and a conductor circuit. CONSTITUTION:An electronic component mounting substrate 9 is made to serve in such a manner that electronic components 7 mounted on it are connected to another large scale substrate or the like through leads 1 which extend from a wiring substrate 5, and the leads 1 serving as an external connecting terminal 2 is connected to a conductor circuit 6 mounted on the wiring substrate 5 through an electrically conductive bonding agent 8 such as resin conductive paste or the like which contains a metal filler of silver, copper, gold, or the like or a composite filler of them or the like. And, a metal plating of nickel, copper, or gold or a composite metal plating of them is performed so as to form a plating layer 4 continuously in one piece on the surfaces of the conductive bonding agent 8, the leads 1 connected to both the sides of the bonding agent 8, and the conductor circuit 6. |
