| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide cooling structure having excellent cooling capacity also in simple structure. SOLUTION: A first heart pipe 11 is so provided as to exchange heat with heat transfer members on the surface not equipped with the processor out of the surface of a substrate 1. An exterior member 14 made of a substantial rigid body in high thermal conductivity is heat giving and receivably arranged on the surface equipped with the processor 4 not of the surface of the substrate 1. Heat transfer member 16 for radiation is so provided as to exchange heat with the exterior member 14 and the first heat pipe 11 at a place between the exterior member 14 and the first heat pipe 11 where the substrate 1 is not interposed. Furthermore, the first heat pipe 11 and the exterior member 14 are tightened to be fixed by holding members 17, 18 in the state of holding the processor 4, the substrate 1 and the heat transfer member 16 for radiation between the first heat pipe 11 and the exterior member 14.</p> |
