METHOD AND APPARATUS FOR INSPECTING SOLDERED JOINT OF ELECTRONIC PART,申请号JP19960054024-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR INSPECTING SOLDERED JOINT OF ELECTRONIC PART
摘要
申请公布号	JPH09222454(A)	申请公布日期	1997.08.26
申请号	JP19960054024	申请日期	1996.02.16
申请人	NEC CORP	发明人	YOSHIMA MASAYUKI
分类号	G01R31/26;G01R29/12;G01R31/02;G01R31/302;H05K3/34;(IPC1-7):G01R31/02	主分类号	G01R31/26
代理机构		代理人
主权项
地址

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