发明名称 Photosensitive resin composition and method for forming photoresist pattern using the same
摘要 A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide type photosensitive compound and a solvent, in which the quinonediazide type photosensitive compound contains a quinonediazide sulfonic acid ester of a polycondensate (d) of at least one phenolic compound (a) of the formula (A) with at least one hydroxy aromatic aldehydes (b) of the formula (B) and at least one carbonyl compounds (c) of the formula (C), and the mixing ratio ((b)/(c) mol ratio) of the hydroxy aromatic aldehydes (b)/the carbonyl compounds (c) is from 1/99 to 99/1, and the polycondensate (d) has a weight average molecular weight of from 600 to 2,000 in terms of polystyrene calculation: <IMAGE> [A] <IMAGE> [B] <IMAGE> [C] (wherein R1 is an alkyl group having a carbon number of from 1 to 4, an alkoxy group having a carbon number of from 1 to 4 or a hydroxyl group, R2 is an alkyl group having a carbon number of from 1 to 4 or an alkoxy group having a carbon number of from 1 to 4, R3 and R4 are respectively a hydrogen atom, an alkyl group having a carbon number of from 1 to 4, an aryl group or an aralkyl group, l is an integer of from 0 to 3, m is an integer of from 0 to 4, n is an integer of from 1 to 5, and the total number of m and n is not more than 5, provided that plural R1 or R2 may be respectively the same or different when l or m is an integer of at least 2).
申请公布号 US5660967(A) 申请公布日期 1997.08.26
申请号 US19950579269 申请日期 1995.12.27
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 NISHI, MINEO;NAKANO, KOJI;TAKADA, YOSHIHIRO
分类号 C08G8/28;G03F7/023;(IPC1-7):G03F7/023;G03F7/30 主分类号 C08G8/28
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