摘要 |
A process and an apparatus for the ultrasonic testing of a component accessible only through a gap, includes driving a carrier accommodating an ultrasonic testing head into an annular gap and bringing the ultrasonic testing head into a position of alignment with the component, for the purposes of repeated testing of components disposed in the poorly accessible gap. Subsequently, the ultrasonic testing head is driven out from the carrier approximately at right angles to the driving-in movement, and is brought into contact with the component. After completing the testing process, the ultrasonic testing head is driven once more into the carrier and brought into a position of alignment with the next component.
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