| 摘要 |
<p>PURPOSE:To obtain a low-priced platinum temperature sensor having little decrease in resistance temperature coefficient, excellent adhesive strength and excellent solder wettability by a method wherein an electrode, formed by sintering conductive paste mainly composed of silver or gold at a specified temperature, is used as a lead-out electrode of a platinum resistance element. CONSTITUTION:No.1 in the diagram is the substrate, consisting of 99.5% alumina, to be used as a supporting substrate, and No.2 is a platinum resistance film of 11mum in thickness which is formed on the above-mentioned alumina substrate 1 by vapor deposition using an electron beam. No.3 is a lead-out electrode mainly composed of silver, and it is formed by sintering the electrode paste, consisting of silver, palladium and lead borosilicate glass which are mixed at the ratio of 83:10:7 at 420 to 720 deg.C. As said paste contains the glass of low softening point, it adheres firmly to the base layer of ceramic substrate 1 even when the paste is sintered at a low temperature, and the biting of solder can be made little, and solderability can also be improved by allowing palladium to be contained in the paste.</p> |
