| 摘要 |
A semiconductor device which realize reduction of thickness with maintaining shielding effect has a shielding package having a substrate with a plurality of electrode pattern provided on a surface thereof and side walls upwardly formed in the peripheral end part of the surface thereof, a semiconductor chip having a plurality of electrodes directly connected to the electrode patterns of the shielding package, respectively, an insulating resin layer of a low dielectric constant formed on the substrate enclosed by the side walls so as to cover, and a conductive resin layer formed on an entire surface of the insulating resin layer.
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