| 摘要 |
PURPOSE:To reduce adhesion of dust for preventing disconnection and inferior influence of static electricity by forming the wire-retaining surface of a clamp member for retaining a bonding wire out of a cermet where the surface roughness is 0.2mum or less. CONSTITUTION:A clamp member 1 is a disc body or a square plate body consisting of a cermet, one surface is adhered to an arm 2, and the other surface is a smooth wire-retaining surface 1a. Also, the edge part of the wire-retaining surface 1a is an R surface 1b whose radius of curvature exceeds 0.2mm and the center line average roughness (Ra) is 0.2mum or less within a range where a distance t of the wire-retaining surface 1a and R surface 1b from the wire- retaining surface 1a is within 0.2mm. Thus, two clamp members 1 are placed at both sides of a wire 3, thus repeating retention and opening of the wire 3 during bonding operation but eliminating danger of disconnection of the wire 3. Also, inferior influence of static electricity to a chip element 5 can also be prevented. |
