发明名称 Profiled substrate heating
摘要 An apparatus and method for thermal processing, and more particularly for rapid thermal processing wherein a first thermal radiator generates and projects a first pattern of thermal radiation onto a first surface of a substrate, and wherein a second thermal radiator generates and projects a second pattern of thermal radiation onto a second surface of the substrate. The temperatures on the first and second surfaces are sensed by sensing means. Means for controlling the first and second thermal radiator means in response to the sensing means cause a prescribed temperature profile to be produced within the substrate.
申请公布号 US5650082(A) 申请公布日期 1997.07.22
申请号 US19950486653 申请日期 1995.06.07
申请人 APPLIED MATERIALS, INC. 发明人 ANDERSON, ROGER N.
分类号 C23C16/48;C30B25/10;C30B31/12;F27D19/00;H01L21/00;H01L21/02;(IPC1-7):H01L21/26 主分类号 C23C16/48
代理机构 代理人
主权项
地址