| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition containing a maleimide compound, an organic peroxide, a specific butadiene rubber, etc., having excellent adhesivity and thermal dimensional stability of the adhesive resin and giving an adhesive tape useful as a circuit board material, etc. SOLUTION: This resin composition contains (A) 100 pts.wt. of a maleimide compound having >=2 maleimide groups (e.g. 1-methyl-2,4-bismaleimidebenzene), (B) 0.5-8 pts.wt. of an organic peroxide (e.g. t-butyl cumyl peroxide), (C) 30-200 pts.wt. of an acrylonitrile-butadiene rubber containing carboxyl group and (D) 1-100 pts.wt. of a diaminosiloxane compound of the formula (R1 and R2 are each a bivalent 1-4C aliphatic or aromatic group; R3 to R6 are each a univalent aliphatic or aromatic group; (k) is 1-20) as essential components. The composition is preferably further compounded with (E) 0.01-10 pts.wt. of an agent for accelerating the amidation reaction of the components C and D, preferably a strong base catalyst such as imidazole. |
