发明名称 Configured indium gasket for thermal joint in cryocooler
摘要 <p>An indium gasket (80) having a configuration which allows the indium to reach its yield point at a relatively low contact pressure. The indium gasket is provided with a multiplicity of openings (84) which are filled by the deforming indium during compression between the cryocooler and the cryocooler interface sleeve of a superconducting magnet system. The creation of openings in the gasket has the effect of decreasing the mechanical interface pressure at which the indium yields. The indium flows at a mechanical interface pressure that does not exceed the structural strength requirements of the cryocooler. The indium flows into the empty spaces formed by the openings (84), thereby providing the necessary thermal conductance between the cryocooler and the interface sleeve. The result is a relatively small temperature difference between the interface sleeve and the cryocooler during cooling of the superconducting magnets. <IMAGE></p>
申请公布号 EP0781957(A2) 申请公布日期 1997.07.02
申请号 EP19960309276 申请日期 1996.12.19
申请人 GENERAL ELECTRIC COMPANY 发明人 ECKELS, PHILLIP WILLIAM;WOODS, DANIEL CHRISTIAN
分类号 F16J15/08;A61B5/055;F17C13/00;F25D19/00;H01F6/04;(IPC1-7):F17C13/00 主分类号 F16J15/08
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