发明名称 |
Integrated circuit package assemblies including an electrostatic discharge interposer |
摘要 |
An integrated circuit package assembly incorporating an electrostatic discharge (ESD) interposer is disclosed. The assembly includes a semiconductor chip including a plurality of chip input/output terminals. The interposer is formed using a substrate which supports the chip and includes an arrangement having a plurality of integrally formed ESD protection circuits for providing ESD protection to predetermined ones of the chip input/output terminals.
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申请公布号 |
US5644167(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19960609644 |
申请日期 |
1996.03.01 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
WEILER, PETER M.;BELANI, JAGDISH G. |
分类号 |
H01L23/60;(IPC1-7):H01L23/62;H01L23/52;H01L25/065 |
主分类号 |
H01L23/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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