| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the mechanical separating force of a push-up using a dicing tape having low temperature stripping characteristics. SOLUTION: The semiconductor production machine comprises a mechanism for pushing up a chip 2, obtained by separating a semiconductor wafer bonded onto a dicing tape 4 through a temperature active adhesive by dicing, through the dicing tape 4, a pickup collet 8 for sucking the chip 2 with vacuum force, and piping 9 for cooling the dicing tape 4 directly under the chip 2. The dicing tape 4 directly under the chip 2 is cooled through the cooling piping 9 to weaken adhesion of the dicing tape 4 thus separating the chip 2 therefrom with small force while suppressing mechanical stress being applied to the chip 2.</p> |
