CHIP MOUNTING BOARD MODULE AND REPAIRING METHOD OF FAILING CHIP

摘要

The chip-on-board module comprises a plurality of tabs for interfacing an electric signal with other circuit; a plurality of module chip pads for mounting a semiconductor chip; an extra module chip pad for mounting a semiconductor chip with which a failure chip is exchanged; a plurality of module bonding pads which is positioned around the plurality of module chip pads and the extra module chip pad; a wire pattern which electrically connects the module bonding pads with the extra semiconductor chips so as to repair the failure chip according to an operational data.