发明名称 |
Semiconductor device e.g. DRAM with fuse |
摘要 |
An interlayer insulation layer (2) covers the fuse layer (1). In the insulating layer is located a concave section (2a) with an aperture width (W1), exceeding the two-dimensional width of the fuse layer. The concave section lies on the insulating layer surface directly above the fuse layer. On the insulation layer is deposited a passivating layer (4) with a first aperture (4R) directly above the fuse layer, exposing the bottom face of the concave section. The aperture has a second width (W2), smaller than the first one.
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申请公布号 |
DE19619737(A1) |
申请公布日期 |
1997.06.05 |
申请号 |
DE1996119737 |
申请日期 |
1996.05.15 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
TSUKUDE, MASAKI, TOKIO/TOKYO, JP;ARIMOTO, KAZUTAMI, TOKIO/TOKYO, JP |
分类号 |
H01L21/60;H01L21/768;H01L21/82;H01L21/8242;H01L23/485;H01L23/522;H01L27/108;(IPC1-7):H01L23/525 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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