Coverless pin grid array socket

摘要

An electrical socket (10) is disclosed for an electronic package (2) having an array of pins (4) wherein at least some of the pins are standoff pins each having a respective cross-sectional enlargement (6). The socket comprises a housing having a wall (12) defining a package mounting surface (14) and an oppositely facing locking surface (58). The wall has an array of openings (18, 48) which receive the pins and permit free passage of the enlargements through the wall. The openings include lateral channels (56) which are narrower than the enlargements. The package is secured to the socket by inserting the leads into their associated entranceways and moving the package transversely over the mounting surface so that the enlargements become trapped beneath the locking surface.