| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield in the production stage by forming the surface of a pad layer flush with or lower than the surface of a protective layer. SOLUTION: A terminal layer 14 is formed via an insulating layer 2 on a substrate and the bump layer 12 is formed at severalμm thickness via a seed layer 11 on this terminal layer 14. The surface thereof is enclosed by the protective layer 16 having 30 to 40μm thickness. The seed layer 19 consisting of Ni-Fe or Au, etc., is formed at nearly 1000Åthickness on the surface of the bump layer 12 and, further, the pad layer 13 consisting of Au is formed at severalμm thickness on the surface of the seed layer 19 and is formed lower than the surface of the protective layer 16. The surface of the pad layer 13 is formed flush with the surface of the protective layer 16 or lower than the surface of the protective layer 16, thereby, the yield in the production stages is improved.
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