CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP AND INTERCONNECTION SUBSTRATE THEREFOR

摘要

PROBLEM TO BE SOLVED: To ensure a superior connection reliability even for a thin semiconductor chip by connecting the thickness-specified semiconductor chip to an interconnection substrate with adhesives where a plurality of dummy electrodes exist within a connecting region in the form of circular or a polygonal shape as their connecting face is projected. SOLUTION: Dummy electrodes 6 are formed on a connecting face of a substrate 4 within a region surrounded with marginal electrodes 2 on a semiconductor chip 1 when the chip 1 is projected after connection. The electrodes 6 exist in blocks of several electrodes in the form of a circular or polygonal shape as the connecting face is projected. If the chip 1 of 0.3mm or less thick is pressed or hot pressed through an adhesive agent 11 between the chip and interconnection substrate, the chip will not warp, thus greatly improving the connection reliability.