| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to properly use a nickel alloy lead frame by a method wherein the surface of a nickel alloy external lead is solder-plated, another soler plating is provided on the exposed surface of a heat radiating plate using a nickel-plated copper plate on the exposed surface of a resin package. SOLUTION: Solder plating 19 is provided on the external surface of a nickel alloy outer lead 17. On the other hand, on a metal heat discharging plate 12, nickel plating 18 is provided on the surface 12a which is exposed to the bottom face of a resin package 11, and solder plating 19 is provided on the nickel plating 18. The above-mentioned solder plating 19, formed on the surface of the metal heat radiating plate 12, is simultaneously formed when a lead frame is solder-plated in the couse of manufacturing a semiconductor device 10. As a result, the nickel alloy lead frame can be used properly. |
