| 摘要 |
PURPOSE: To reduce the cost of a product and improve the reliability at mounting and heat radiation efficiency, concerning a semiconductor device where a semiconductor chip is mounted on a substrate by flip chip bonding. CONSTITUTION: This semiconductor device posses a semiconductor chip 21, a substrate 22, where this semiconductor chip is mounted by flip chip bonding method, sealing resin 24, which is arranged on the substrate 22 so as to seal the semiconductor chip 21, and a cap 23, which is arranged in such a constitution as to be thermally connected to the semiconductor chip 21 on this sealing resin 24, and the semiconductor chip 21 is made to function as a spacer, and by this semiconductor chip 21, the height to the substrate 24 of the sealing resin 24 interposed between the cap 23 and the substrate 22 is regulated to be constant.
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