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发明名称
DIES BONDER
摘要
申请公布号
JPH0917812(A)
申请公布日期
1997.01.17
申请号
JP19950166550
申请日期
1995.06.30
申请人
OKI ELECTRIC IND CO LTD
发明人
SATO KUNIO
分类号
H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/52
代理机构
代理人
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地址
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