发明名称 POLISHING METHOD FOR WORKPIECE, AND POLISHING DEVICE THEREFOR
摘要 PURPOSE: To satisfactorily polish a workpiece having a longitudinal dimension longer than the cycle zone width by tracking the workpiece in a non-rotated state in the direction crossing a tangent making contact with the rotating direction of a ring polisher disc while rotating the ring polisher disc to polish the surface to be polished of the workpiece. CONSTITUTION: A workpiece is set with posture being regulated by a workpiece holding plate 3P. While a ring polisher disc 5 is rotated, the workpiece 42 is tracked (moved to reciprocate a reciprocating base 24 in an arrowed direction D-D) in non-rotated state in the direction crossing a tangent making contact with the rotating direction E of the ring polisher disc 5, whereby the surface to be polished of the workpiece is polished. An amplitude (the maximum amplitude of the reciprocating base 24) of tracking motion of the workpiece can be changed by adjusting a position to a guide groove 20 of a rotating base 21.
申请公布号 JPH08336753(A) 申请公布日期 1996.12.24
申请号 JP19950144378 申请日期 1995.06.12
申请人 TOPCON CORP 发明人 KUROSAWA HIROSHI
分类号 B24B37/07;B24B37/10 主分类号 B24B37/07
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