发明名称 MULTI-LAYERED PRINTED CIRCUIT BOARD DRILLING METHOD
摘要 PURPOSE: To drill holes from a surface layer to a desired internal layer even if a multi-layered printed circuit board warps by using the point where a drill abuts on an abutting plate as a starting point and feeding the drill a set feed amount from this starting point to drill. CONSTITUTION: An abutting plate 3 made of conductive materials is put on the top face of a multi-printed circuit board 1, and voltage is applied between a drill 2 and abutting plate 3 beforehand, and in drilling the multi-layered printed circuit board while driving the drill 2, the point where electrical conduction is detected between the drill 2 and the abutting plate 3 is used as a starting point 20. The drill 2 is fed from the starting point 20 the feeding amount set, forming a surface layer IVH in the multi-layered circuit board 1. At this moment, voltage is applied to the abutting plate 3 through a stack pin 5 positioning and fixing the multi-layered printed circuit board 1 and abutting plate 3.
申请公布号 JPH08323697(A) 申请公布日期 1996.12.10
申请号 JP19950127996 申请日期 1995.05.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SATO KOICHI
分类号 B23B41/00;B26F1/16;H05K3/00;H05K3/46;(IPC1-7):B26F1/16 主分类号 B23B41/00
代理机构 代理人
主权项
地址