发明名称 RESIN COMPOSITION AND METHOD FOR CHEMICALLY ETCHING SAME
摘要 PURPOSE: To obtain a resin compsn. for the production of multilayer circuit boards by compounding a specific epoxy resin, a specific carboxylated rubber, a curative for an epoxy resin. and a cure accelerator. CONSTITUTION: This compsn. comprises 30-100 pts.wt. epoxy resin having a number average mol.wt. (Mn) of 1,200 or higher, 30-70 pts.wt. carboxylated acrylic or acrylonitrile-butadiene rubber, a curative for an epoxy resin, and a cure accelerator. The curative is pref. a novolak phenol resin or a novolak cresol resin in an amt. of 30-100 pts.wt. The compsn. further contg. 0.5-20 pts.wt. ion scavenger (e.g. silica gel) is still pref.
申请公布号 JPH08302161(A) 申请公布日期 1996.11.19
申请号 JP19950111719 申请日期 1995.05.10
申请人 HITACHI CHEM CO LTD 发明人 INADA TEIICHI;TAKANEZAWA SHIN
分类号 C08L13/00;C08L33/08;C08L63/00;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):C08L63/00 主分类号 C08L13/00
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