| 摘要 |
Ball grid array devices 10 are mounted in a burn-in and test socket which has a top surface with windows 23 for the ball terminals 12 depending from the ball grid array device 10. Contact fingers 40 mounted on the base 21 of the socket extend through a bending plate 29 and into the windows 23 from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface (as shown), the ends 42 of the contact members 40 are moved into contact with the ball terminals 12. The end of the contact members are urged into contact with the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket. Alternatively, the top surface may move latterally with respect to the bending plate. |
