发明名称 PLATE-SHAPED MEMBER TRANSPORTING APPARATUS AND PLATE-SHAPED MEMBER TREATING APPARATUS USING IT
摘要 PURPOSE: To obtain a wafer transporting apparatus and a wafer treating apparatus for transporting and treating a wafer in a standing state. CONSTITUTION: A wafer transporting apparatus 10 comprises a holding base 15 moved forward and backward relative to a movable base 13 by a pantagraph apparatus 14 supported at one end thereof by the movable base 13, and the holding base 15 holds a wafer 1 in a standing state. A wafer treating apparatus 5 comprises treating sections 21, 22, 41, 42, 61, 62 and each treating section treats the wafer in the standing state. The movable base 13 is moved to a waiting position in each treating section, and the holding base 15 is reciprocated between the treating section and the movable base by the pantagraph apparatus 14. Thus, the wafer can be transported and treated in the standing state so that the floor area occupied by the wafer transporting apparatus and the wafer treating apparatus can be decreased. The wafer in the standing state is made parallel to the down flow so that dust adhesion to the wafer due to the down flow can be suppressed.
申请公布号 JPH08288362(A) 申请公布日期 1996.11.01
申请号 JP19950113563 申请日期 1995.04.14
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 YAMAGAMI TAKASHI
分类号 B65G49/07;H01L21/027;H01L21/677;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B65G49/07
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