| 摘要 |
PURPOSE: To obtain a wire bonder and a bonding method for bonding a wire between an electrode formed on a semiconductor chip and a lead terminal arranged on the outside of the semiconductor chip in which the loop of the bonding wire can be shaped correctly in the vertical and lateral directions. CONSTITUTION: A wire connected, at the forward end thereof, with an electrode is led to a lead terminal 4 through a pectinate groove made in a protrusion 24 provided between a semiconductor chip 1 and the lead terminal 4. The shape of the wire loop is corrected by means of the pectinate groove made in the protruding part of a loop correction metal operating toward the wire from below the semiconductor chip 1. |
