发明名称 Method for producing a semiconductor trench capacitor cell
摘要 <p>A semiconductor trench capacitor structure having a first level aligned isolation structure and buried strap that extends from within the trench into the doped semiconductor substrate. The semiconductor trench capacitor structure may be fabricated by forming a shallow trench within the trench capacitor and semiconductor substrate, depositing a layer of conductive material within the shallow trench, using a mask to define and recess the strap and depositing insulating material within the shallow trench. &lt;IMAGE&gt;</p>
申请公布号 EP0738006(A2) 申请公布日期 1996.10.16
申请号 EP19960480036 申请日期 1996.03.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MCALPINE KENNEY, DONALD
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L27/04
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