| 摘要 |
<p>PURPOSE: To reduce a degree, to which shock applied to an IC card acts on an IC module, to thereby prevent loss of data by providing an elastic adhesive member around a lower surface of a substrate in a manner to surround a resin molding portion to adhesively fix the same in a recess of a card substrate. CONSTITUTION: An IC card 10 is obtained by constructing an IC module 20 such that an external terminal 22 is provided on a top surface of a substrate 21, an IC chip 23 is provided on an underside of the substrate with a circuit pattern layer 25 and chip adhesives 33 therebetween, and the IC modules 20 and the IC chip 23 are connected to each other by bonding wires 28. A surface of a card substrate 11 is formed with a recess E, to which the IC module 20 is adhesively fixed by an elastic adhesive member 30 to provide the IC card 10. A slight cushioning space K is defined between a bottom surface of the recess E and a resin molding portion 27 and between the IC module and an inner surface wall of the recess E. The adhesive member 30 is formed by coating both surfaces of an elastic core material 31 with adhesives 30a.</p> |
