发明名称 MOLD APPARATUS FOR MOLDING RESIN
摘要 PURPOSE: To prevent the generation of mold release inferiority between an upper fixed mold and a molded product by providing the wall part of the cavity for forming the outer peripheral part of the molded product to a movable mold part and forming an undercut part to the wall part. CONSTITUTION: An undercut part 29A is formed to the circumferential part of a disc-shaped cavity 30B, that is, the circumferential wall of the circumferential part 29 of a movable mold 20. Therefore, a projection part 40A is formed to the circumferential part of the molded product 40 molded in the disk-shaped cavity 30B corresponding to the undercut part 29A and chamferring parts 40B are formed on both sides of the projection part 40A. The projection part 40A of the molded product 40 is engaged with the undercut part 29A of the circumferential part 29 of the movable mold 20. When the lower movable mold 20 is moved, that is, a disc part 27 and the circumferential part 29 are moved by this engagement, the molded product 40 is moved along with them and demolded from a stamper 35.
申请公布号 JPH08244038(A) 申请公布日期 1996.09.24
申请号 JP19950054682 申请日期 1995.03.14
申请人 SONY CORP;SONY DISC TECHNOL:KK 发明人 KISHI SHINSUKE;HIRAYAMA NOBUYUKI
分类号 B29C33/44;B29C45/26;B29C45/42;B29C45/44;B29C45/56;B29L17/00;(IPC1-7):B29C33/44 主分类号 B29C33/44
代理机构 代理人
主权项
地址