发明名称 Integrated circuit fabrication with interlevel dielectric
摘要 An interlevel dielectric comprised of phosphorus-doped glass surrounding the second polysilicon level of an SRAM cell is disclosed. The second polysilicon is generally a cell local interconnect. The phosphorus-doped glass layer efficiently getters sodium from underlying layers. The phosphorus-doped glass layer is utilized although another doped gettering layer may be used at a higher level of the circuit.
申请公布号 US5559052(A) 申请公布日期 1996.09.24
申请号 US19940366192 申请日期 1994.12.29
申请人 LUCENT TECHNOLOGIES INC. 发明人 LEE, KUO-HUA;YU, CHEN-HUA D.
分类号 H01L21/322;H01L21/316;H01L21/66;H01L21/8244;H01L27/10;H01L27/11;(IPC1-7):H01L21/31 主分类号 H01L21/322
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