| 摘要 |
PROBLEM TO BE SOLVED: To obtain a tacky agent, comprising an elastomer, a tackifying resin and a curing agent in a specific proportion, excellent in chip holding and nonfouling properties, capable of performing the full dicing into minimal chips and useful as a sheet for fixing a semiconductor wafer. SOLUTION: This tacky agent of a sheet for fixing a semiconductor wafer comprises (A) 100 pts.wt. elastomer such as a natural rubber, (B) 5-200 pts.wt. tackifying resin such as a rosin-based resin and (C) 0.05-30 pts.wt. curing agent such as tolylene diisocyanate. Furthermore, the tacky agent of the sheet for fixing the semiconductor wafer preferably has 3.0×10<5> to 5.9×10<6> dyn/cm<2> storage elastic modulus and 20-300gf/20mm peel strength from a semiconductor wafer at 180 deg. (at 300mm/min peeling rate). |
