A MOVABLE HEAT PIPE APPARATUS FOR REDUCING HEAT BUILD UP IN ELECTRONIC DEVICES

摘要

A rotatable and slidable heat pipe apparatus (10) for transferring heat away from a microprocessor chip more rapidly than by heat sink surface area dissipation to the surrounding air alone, comprising a heat sink (30) with an integral cylindrical passageway (32) adapted to receive a first end (22) of a heat pipe (20) shaped like a crankshaft, and a heat spreader (40) formed from a metal plate (44) with a first end rolled up to define a cylindrical opening (42) adapted to receive a second end (24) of the heat pipe (20). The heat spreader (40) is attached to an underside of a keyboard.