TRIAL MANUFACTURE SUPPORTING DEVICE, SUBSTRATE FOR IC MOUNTING, AND BUS DEVICE

摘要

PURPOSE: To manufacture a device which is easily corrected and high in reliability and uses a digital IC by way of trial in a short time at low cost and also manufacture a device to which plural ICs are connected by a bus. CONSTITUTION: The trial manufacture supporting device is equipped with the bus device 10 and the substrate 20 for IC mounting which is connected to the bus device 10. The bus device 10 is equipped with plural connectors 11 and a sub-substrate 12 having bus wires for connecting the connectors 11 mutually to a bus. The substrate 20 for IC mounting has a connector 21 for connecting with the connector 11 of the bus device 10, an IC socket 23 where an IC is inserted, and FPGA 22 which is connected to the IC socket 23 and connector 21. An optional IC is inserted into the IC socket 23 of the substrate 20 for IC mounting, which is inserted into the bus device 10; and the FPGA 22 is programmed to manufacture the device using the IC by way of trial.