| 摘要 |
PURPOSE: To provide a method of mounting a semiconductor device, by which a semiconductor device can be mounted on a circuit board without dispersion of connection resistance value with a small number of processes. CONSTITUTION: This method includes a salient electrode formation process, which forms a salient electrode 8 on the electrode 2 of a semiconductor device 1 by wire bonding method, and a leveling transcription process which transcribes conductive adhesive films 11 to the head faces of the salient electrodes 8 by stopping them for a specified time, in condition that the head faces of the salient electrodes 8 equalized in level, when pulling up a semiconductor device 1 after equalizing the level of the salient electrode 8 by pushing the salient electrodes 8, with specified force, against the plane of a leveling transcription stage 10 where the conductive adhesive film 11 is applied. Furthermore, this has a mounting process, which positions the salient electrode 8 where the conductive adhesive film 11 is transcribed, on the electrode of a circuit board on which to mount the salient electrode, and a process of hardening the conductive adhesive transcribed on the salient electrode 8. |
