发明名称 Multiple layer ceramic substrate for electronic circuit
摘要 The substrate is of a large surface, insulating base layer (1) upon which is formed several individual substrates (3) for electric circuits, defined by rated break lines (18-20). Each consists of a base layer partial portion (4) and at least one metallising (6,8) on the partial portion surface. There are stabilising regions (14,15) against inadvertent breaking. The base layer has numerous apertures (2), whose edges form each at least one edge line of the partial portion of each individual substrate. At least one metallising (6) of each substrate protrudes beyond the edge into the aperture.
申请公布号 DE19504378(A1) 申请公布日期 1996.08.14
申请号 DE1995104378 申请日期 1995.02.10
申请人 CURAMIK ELECTRONICS GMBH, 92676 ESCHENBACH, DE 发明人 SCHMIDT, KARSTEN, 04860 TORGAU, DE;MAIER, PETER, 91207 LAUF, DE;SCHULZ-HARDER, JUERGEN, 91207 LAUF, DE
分类号 H01L23/13;H01L23/498;H05K1/03;H05K3/00;H05K3/40;(IPC1-7):H05K1/02;H01L23/48 主分类号 H01L23/13
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