| 摘要 |
<p>PURPOSE: To make thin a seal for sealing a semiconductor device so as to cover its top face by electrically connecting electrodes formed on opposite side faces of this device to the top ends of lead terminals, respectively. CONSTITUTION: Two lead terminals 1 and 2 are opposed in the same plane, an insulator 3 is formed to bridge over these terminals, a semiconductor device 4 is laid with adhesives on the top face of the insulator 3 and the device 4 and its periphery are sealed with a seal 5. A protrudent electrode 6 is formed on the right side face of the device 4, flat plate-like electrode 7 is formed on the left side face thereof. The electrodes 6 and 7 are electrically connected to the top ends of lead terminals 1 and 2 through solders 8 and 9, respectively. Thus, the seal 5 to seal the device 4 can be made thin so as to cover the top end thereof.</p> |
